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The Importance of SMD Glue in the Soldering Process

Author: Laurie Kneller
by Laurie Kneller
Posted: Jul 31, 2018

Surface mount device (SMD) assembly requires a specially formulated adhesive to keep the components in place and ensure the formation of an electrical bond between them and the printed circuit board. SMDs are the parts with pin contacts, and before they are soldered, they are bonded to a PCB with a specialized SMD solder paste. For that reason, it makes sense to choose a high-quality soldering material that will enable several electrolytic capacitors, coils, and capacitors to be placed precisely on the board, and cured in a few seconds to prevent them from becoming dislodged or falling off. After securing the parts, they go through a reflow-soldering process in one working step to speed up production and save time.

High-quality soldering materials are designed to hold the bottom side in place. It can work on some types of surface mount and mixed technology components during wave soldering, too, as long as you choose a good non-stringing and non-slumping SMD solder paste. Specialized printing equipment, pin transfer, and dot dispensing can be used to apply the adhesive for a consistent dot profile and speedy curing. You might find that this type of soldering material may be slightly less viscous to suit certain applications. It usually comes in a distinctive, easily noticeable color, too, such as red or yellow, so you can easily spot it when applied.

Get your SMD solder paste and other soldering materials only from a reputable manufacturer of products and solutions for SMT assemblies. That way, you can be sure that you are getting a high-quality product that will ensure the dependability of your equipment. Good SMD solder paste offers room temperature stability, with a six-month shelf life, as long as it is stored in room temperature.

The formulation prevents stringing and slumping and enables screen printing with specially made laser stencils to meet your SMD adhesive guidelines. Using this soldering material requires a correct thermal profile to make sure that the adhesive can achieve a homogeneous cure and maximum mechanical strength. To prevent issues, make sure that the material is heated to an appropriate temperature for a specific timeframe, and consider a 1.5°C or 2.0°C- per second maximum thermal ramp rate to ensure a homogeneous cure.

About the Author:

Alpha Assembly Solutions, Inc. is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.

About the Author

Alpha Assembly Solutions Inc. is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting.

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Author: Laurie Kneller

Laurie Kneller

Member since: Jul 28, 2016
Published articles: 35

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