Global Advanced Packaging Technologies Market – Industry Trends and Forecast to 2026

Market Definition: Global Advanced Packaging Technologies Market

Advanced packaging is specially designed to improve the device performance by using integrated circuits which protect the metallic part from damaging. 3D integrated circuits, 2.5D integrated circuits, fan out wafer level package and among others are some of the common types of advanced packaging technologies. Different types of integrated circuits are manufactured as per the need of the packaging. They are widely used in industries such as healthcare, automotive, aerospace, defense and others.

Market Analysis: Global Advanced Packaging Technologies Market

Global advanced packaging technologies market is set to witness a substantial CAGR of 7.67% in the forecast period of 2019- 2026. The report contains data of the base year 2018 and historic year 2017. Increasing R&D investment for product development and technological advancement and development are the factor for the growth of this market.

Key Market Competitors:

Few of the major competitors currently working in the global advanced packaging technologies market are ASE Group., Amkor Technology, Siliconware Precision Industries Co., Ltd., STATS ChipPAC Pte. Ltd., SÜSS MICROTEC SE, IBM Corporation, COVERIS, Universal Instruments Corporation, Heidelberg Instruments, McKinsey & Company., Advanced Packaging Technology (M) Bhd, Veeco Instruments Inc., Boschman, CCL Industries., Jawla Advance Technology, ASM Pacific Technology, Orbotech Ltd., Taiwan Semiconductor Manufacturing Company Limited, ams AG, NAURA Akrion Inc., Rudolph Technologies and others

Market Drivers:

• Rising awareness about its advantages over conventional packaging technologies will drive the market growth
• Increasing R&D activities will propel the growth of the market
• Rising demand of these packaging from food and beverage industry will also act as a factor driving the market growth
• Technological advancement and development in packaging technologies is driving the growth of the market

Market Restraints:

• Problem related to the heating in devices will restrain the market growth
• Dearth of standardization will also hamper the growth of the market

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Global Advanced Packaging Technologies Market Segmentation:

• Global Advanced Packaging Technologies Market By Technology (Active Packaging, Smart and Intelligent Packaging)
• End- User (Food, Beverages, Alcoholic Beverages, Non-Alcoholic Beverages, Pharmaceuticals, Industrial & Chemicals, Cosmetics & Personal Care, Agriculture, Others)
• Type (3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Silicon in Package, Fan Out Wafer Lever Package, Wafer Level Chip Scale Package, Flip Chip, Others)
• Industry Vertical (Consumer Electronics, IT & Telecommunication, Industrial, Automotive & Transport, Healthcare, Aerospace & Defense, Others)
• Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa) – Industry Trends and Forecast to 2026

Competitive Analysis:

Global advanced packaging technologies market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of advanced packaging technologies market for Global, Europe, North America, Asia-Pacific, South America and Middle East & Africa.

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