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Global ceramic substrate market
Posted: Aug 02, 2019
Global ceramic substrate market is set to witness a substantial CAGR of 6.65% in the forecast period of 2019- 2026.
Market Definition: Global Ceramic Substrate Market
Ceramic are usually inorganic and non-metallic materials and usually have low thermal and electrical conductivity. Ceramic substrates are wetted and rough surface which are used to create continuous films between conductors. These are also used in diesel and gasoline system in heavy and light duty vehicles. Alumina substrates, beryllium oxide substrate, silicon nitride substrate and other are some of the common type of the ceramic substrate. They are widely used in industries such as telecom, consumer electronics, military, automotive and others. Increasing demand for electronic vehicles is the factor fuelling the market growth.
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Major Market Competitors/Players
Few of the major competitors currently working in the global ceramic substrate market are KYOCERA Corporation, Murata Manufacturing Co., Ltd., CoorsTek Inc., Ceramic Substrates & Components Ltd, MARUWA Co., Ltd., KOA Corporation, Yokowo co., ltd., LEATEC Fine Ceramics Co,.Ltd., NIKKO COMPANY, NGK SPARK PLUG CO.,LTD., ENrG Inc., NIPPON CARBIDE INDESTRIES CO.,INC., TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, ICP TECHNOLOGY Co.,LTD., Advanced Substrate Microtechnology Corporation., Anaren, Chaozhou Three-circle (Group) Co., Ceramic Substrates and Components Ltd., Rogers Corporation, Corning Incorporated, Heraeus Holding, AGC Inc. and others.
Market Segmentations: Global Ceramic Substrate Market
By Product Type (Alumina Substrates, Aluminum Nitride Substrates, Beryllium Oxide Substrates, Silicon Nitride Substrates, Other Ceramic Substrates), End- Use Industry (Consumer Electronics, Automotive, Telecom, Military & Avionics, Industrial, Others), Application (LED, Chip Resistor, Wireless Modules, Other Application), Geography (North America, Europe, Asia-Pacific, South America, Middle East and Africa)
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Market Drivers:
- Rising demand for advanced architecture is driving the market
- Increasing miniaturization of electronic devices will also propel the market
- Growing demand for compact microelectronics packaging solutions will also act as a driver for this market
- Rising prevalence for ceramic substrate in various end- user is also driving the market
- Growing demand for ceramic substrates over traditional metal substrates will also drive the market
Market Restraints:
- High cost of ceramic substrates will restrain the market
- Increasing concern associated with the recyclability and reparability will also hamper the market
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