Modular Semiconductor Reliability Testing System

Accompanied by thermal cycling test systems, and the emergence of technology, semiconductor integrated power line width to reduce gradually, the integration gradually improve, gradually strict for integrated circuit reliability. Now the integrated circuit production and processing by leaps and bounds, to a certain extent, laid the foundation for the research of reliability of integrated circuits. To this, the author according to the study of the practice, semiconductor integrated circuit reliability test and data processing method are briefly analyzed.

Wewon Environmental Chambers Co., Ltd. (WLR) announced enhancements to its Thermal Cycling Test Equipment to include alternative WLR(wafer level reliability) test tools for semiconductor reliability and life prediction applications. PCB Thermal Test is based on the existing single point and multi-point parallel test function of ACS software, adding support for database and the latest RTM(reliability test module).

The research is carried out on the universal fixture problem of full-axis random vibration test in reliability strengthening test. PCB failure analysis was proposed based on the random vibration environment multiaxial non-proportional loading, non gaussian amplitude distribution, wide-band features such as new jig design requirements, and then through theoretical analysis it is concluded that the general principle of fixture design, final design implements a general reliability enhanced test fixture, and the fixture for the thermal cycling test systems Fixture design of full axis random vibration test is a key technology in the engineering application of reliability enhancement test. The research in this paper can provide a wide range of reference for the popularization and application of reliability enhancement test.

The system (10) used to measure semiconductor reliability includes an oven (36), an axial end with an opening that glides into a splice board (12). The splice board (12) includes the oven area (16) Slide), the area can be hold in the oven (36), and in the positioning of the outside of the oven (36) axial connection areas and outside areas (14, 18) in the middle. The temperature sensor (30) locate in the oven area (16), and its calibration device (32) located in the external area (18). The connection area (14) axial contact part of the free edge (34) can slide into electric plug (72). The splice plate (12) made of low thermal conductivity of materials, therefore, the connection areas and outside areas (14, 18) as well as electric plug (72) are not for heating box (36), inserted The connector (12) has a handle (22) at the axial free side or outer area (18). The heat conduction component (38) of the feeder box (36) has a large thermal mass and is close and evenly disposed towards the DUTs(28) on the connector (12).

Semiconductor integrated circuit production and processing technology continues to improve, integrated circuit volume decreases, the circuit structure is difficult and production technology, technical deviation and other factors can not guarantee the reliability of the. To this, the thermal cycling test improve integrated circuit stability, save the cost, some manufacturers began to dedicated to the wafer level stability study, the effect is remarkable. In recent years, China's IC manufacturing industry began to get rapid development, it also for the domestic integrated circuit reliability research has created good conditions. Thermal cycling Test equipment mainly analyzed wafer level reliability test of semiconductor integrated circuit and related data processing means.

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