The role of thermal pads

Thermal pads are used to fill the air gap between the heating element and the heat sink or metal base. Their flexibility and elasticity make it possible to cover very uneven surfaces. The heat is conducted from the separate device or the entire PCB to the metal casing or diffusion plate, thereby improving the efficiency and service life of the heating electronic component. In the use of gaskets, pressure and temperature are mutually restricted. As the temperature rises, after a period of equipment operation, the gasket material will experience softening, creep, and stress relaxation, and the mechanical strength will also decrease. The pressure of the seal is reduced. The gasket is mainly used for the transfer interface between the electronic device and the heat sink or the product shell. It has good viscosity, flexibility, compressibility and excellent thermal conductivity, so that it can completely make the air between the electronic component and the heat sink in use. Exhaust, in order to achieve sufficient contact, the heat dissipation effect is significantly improved. It is used for filling between circuit board and heat sink, filling between IC and heat sink or product shell, filling between IC and similar heat dissipation materials.

characteristic:The thermal pad is specially used to fill the gaps and thermal powder to realize the connection between the heat source and the heat dissipating parts, and transfer the heat out, thereby achieving the effect of heat dissipation. The application of thermal pads can not only solve the problem of heat dissipation, but also have the effect of insulation and shock absorption and reinforcement between components. It is the best choice for the design and development of ultra-thin electronic products.1. High compressibility, soft and elastic, suitable for low pressure application environment;2. With self-adhesive without additional surface adhesive;3. Good thermal conductivity;4. Various thickness options are available.

application:In ordinary life and work, thermal pads have gradually been widely used in control boards of electronic and electrical products, pads and foot pads inside and outside of motors, electronic appliances, automotive machinery, computer hosts, notebook computers, DVDs, VCDs and any Materials for filling and cooling modules are required.1. The bottom or frame of the radiator;2. High-speed hard drive;3. RDRAM memory module;4. Miniature heat pipe radiator;5. Automobile engine control device;6. Communication hardware portable electronic device;7. Semiconductor automatic test equipment.

factor:In the use of thermal pad, pressure and temperature are mutually restricted. As the temperature rises, after a period of operation of the equipment, the thermally conductive gasket material will experience softening, creep, stress relaxation, and mechanical strength. Decrease, the pressure of the seal decreases. vice versa. But in long-term practical use, if the temperature reaches 450°C, the pressure that can be sealed is only 0.3~0.4MPa. For gas media with strong permeability, it is only 0.1~0.2MPa.1. It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;2. It has appropriate flexibility and can fit well with the contact surface;3. Does not pollute the process medium;4. There is sufficient toughness without damage due to pressure and tightening force;5. No hardening at low temperature, small shrinkage;6. Good processing performance, convenient installation and compression;7. The sealing surface is not bonded, and it is easy to disassemble;8. Long service life.

Advantages of thermal pad1. The material is softer, the compression performance is good, the thermal insulation performance is good, the adjustable range of thickness is relatively large, suitable for filling the cavity, the two sides have natural viscosity, and the operability and maintenance are strong;2. The main purpose of selecting thermal silicone sheet is to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat sink. The thermal pad can fill the gap of the contact surface well;3. Since air is a poor conductor of heat, it will seriously hinder the transfer of heat between the contact surfaces, and the installation of a thermally conductive silicone sheet between the heat source and the radiator can squeeze the air out of the contact surface;4. With the supplement of the thermal conductive silicone sheet, the contact surface between the heat source and the radiator can be fully contacted, and the face-to-face contact can be achieved. The temperature response can achieve the smallest possible temperature difference;5. The thermal conductivity of the thermal pad is adjustable, and the thermal conductivity is more stable;6. The process gap in the structure of the thermally conductive gasket is bridged, and the process gap requirements of the radiator and the heat dissipation structure are reduced;7. The thermal pad has insulating properties (this feature requires appropriate materials to be added in the production);8. The thermal pad has the effect of shock absorption and sound absorption;9. The thermal pad has the convenience of installation, testing and reusability.

Shenzhen Aochuan Technology Co., Ltd. Company official website：http://www.aok-technologies.com/