Key characteristics of thermal interface materials

In order to meet the heat dissipation needs of electronic products, there are also a wide variety of thermal interface materials. The commonly used thermal interface materials on the market are: Thermal Pad, Electrically Insulating Thermal Sheet, Thermal Conductive Gap Filler, Thermal Grease, Thermally Conductive Potting Encapsulant, Thermally conductive phase change materials, etc. Today, thermal interface material manufacturers will come to tell you what are the key characteristics of thermally conductive interface materials?

One. Thermal characteristics

1, Thermal impedance

Thermal resistance is equal to R=d/k. This equation shows that thermal resistance is inversely proportional to thermal conductivity k and directly proportional to material thickness. In other words, the thermal conductivity of the material is a constant, and the thermal resistance is only related to the thickness of the material. The thicker the thickness, the greater the thermal resistance, and vice versa.

The contact thermal resistance can be controlled manually, and the appropriate thermal interface material is selected according to the contact surface. In this way, the total thermal resistance can be controlled.

2, Thermal conductivity

Thermal conductivity is a sign that determines the thermal conductivity of thermal interface materials. The greater the thermal conductivity, the better the thermal conductivity.

Two. Electrical characteristics

1, breakdown voltage

The measurement of breakdown voltage is how much voltage the thermally conductive material can withstand under certain conditions. This value indicates the electrical insulation capability of the thermal interface material. This value will be affected in humid and high temperature environments, because the thermal interface material absorbs moisture in the air.

2, Volume resistivity

Volume resistivity is used to measure the volume electronic resistance per unit volume of a material. The volume resistivity is the ability of the thermal interface material to guide the current leakage between the energized component and the metal heat sink. Like the breakdown voltage, it will also be affected by humidity and high temperature and will also decrease the volume resistivity.

Three. elastomer characteristics

1, Compression set

Compression deformation refers to the resultant force applied during deflection. When a compressive load is applied, the elastomer material deforms, but the volume of the material remains unchanged. The compression deformation characteristics may vary depending on the geometry of the part, the deflection rate, and the size of the probe.

2, Stress relaxation

When pressure is applied to the thermal interface material, after the initial deformation, a relaxation process will occur slowly, and then the pressure will be removed. This process will continue until the pressure load and the intrinsic strength of the material reach a balance.

3, Compression deformation

Compression deformation is the result of stress relaxation. If the thermal interface material endures the pressure load for too long, part of the deformation will become a longer deformation, which cannot be recovered after the load is reduced.

Source of information:http://www.aok-technologies.com/, Shenzhen Aochuan Technology Co., Ltd. Professional team of Thermal Interface Material Manufacturer in China

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Shenzhen Aochuan Technology Co., Ltd. Company official website：http://www.aok-technologies.com/