2.5D and 3D ASIC design technologies-Die-to-Die Interposer I/O

The embedded HBM controller and HBM PHY subsystem solutions support the HBM3, HBM2E and HBM2 JEDEC specifications for various technologies and base stations. As a leading proponent of 2.5D and 3D ASIC design technology and applying its experience from the industry's first successful demonstration of multiple 2.5D SiP SoCs, OpenFive plays an important role in advancing industry applications. production that uses HBM 3D stacked DRAM technology. The Die-to-Die IP Subsystem is targeted for various chip solutions in wired communications, AI and HPC applications. Due to recent advances in packaging technology, it is possible to transfer high-speed signals in a package that combines multiple losses or in an interposer or in an organic substrate. Die-to-Die Interposer I/O offers unique value propositions in terms of low-density, high-speed, and low-density connections, providing fast insertion times.

SiFive provides comprehensive USB management and host services to devices. They are connected to our partners on many bases and together. FPGA boards are available for demonstration and prototype use. • Admit that USB 3.1 Gen 1,1, USB 3.1 Perfface

• Enhance the wide range of 324 data
• A Axi values,
• Supports by 32/64/128 bus
• Supporting USB 3.1
• Supported CCCONTLOL, Big, Iachichrone and Transaction
• Great support support
• The device may arrange up to 15 and 15 points work end
• The service stop of work
• FIFO of a very dangerous fight for a good memory
• Srram Senmchoss for FIFO
• Performed DMA support

The higher identification

• Attacks on USB 3.1
• Supporting Jen 1 (5g) and Jen 2 (10g)
• Supports all lower states
• Supports McCo CSR to the driver and state manager
• PC PCs and 8b / 10b for Gen1 and 128b / 132B for Gein2 Support
• Supporting Serdian Interface
• Optional options in the Insh in the phy interface phy and papuca
• Sris construction
• the area of ​​the wall
• Arrangements to verify an important event, including the error
• Arrewdesses check the speakers
• Option to process Manager Controls by CSR Interface
• LOOOOPback Reconcilation for production test
• Option to create a model LFPS in debugging mode

E / stop die - die

• e / s cmos and military programs
• 3.2 Gbps / 1.6 GHG DDR and Fire Inventory
• The length of the length of the 20 mm> 3.2 Gbit / s and PIN rate
• ACT agreement matches with the jedec HBM3 / 2E / 2E / 2E
• the identity of the visitor
• A acceptable option

IP D2D Phys

• PHY D2D is one end (Duplex Special) and based on HBM iOS security
• Any channel consisting of 42 / marks of TX / RX continues
• Support for the length of a channel 5 mm and laten less than 5ns (other connections are available)
• The best in a company is less than 0.5 PJ / COUP Power
• PL to support a shipping hour
• Reference in different machines
• No reduction (FEC) IP as the symptoms that support ber can be caused by 1e-21
• Members program teams, matches different details in different companies.

I'm an professional web content writer and SEO expert.